high density pcb copper foil

9um 12um 18um 35um High Density FPC PCB Copper Foil Specification: Thickness: 9µm～35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: High density, high ...

C11000 PCB Copper Foil GB/TDINENASTMTU2E Cu58Cu ETPC11000 Material introduction:C11000(Cu ETP) Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy it ...

CCL / PCB Insulation Thickness 15um Pure Copper Foil Description CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD), High temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF)...