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strip thin copper foil

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Calidad Lámina de cobre para PCB C11000 fábrica

Lámina de cobre para PCB C11000

C11000 PCB Copper Foil GB/TDINENASTMTU2E Cu58Cu ETPC11000 Material introduction:C11000(Cu ETP) Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy it is not suitable for processing (annealing welding etc.) and use in high temperature ( temperature greater than 370 ° C ) reducing gas. Because it is prone to hydrogen embrittlement
Calidad Lámina de cobre estañado de 0,01 mm de espesor de doble cara fábrica

Lámina de cobre estañado de 0,01 mm de espesor de doble cara

Double Sided Thickness 0.01mm Tin Plated Copper Foil 1. Description Tin-cladded copper foil mainly solved surface un-smoothly and thickness un-even when ordinary copper foil is tinned. It has high peel strength on the laminated surface due to some special treatment. Also the whole process were done in room temperature and would not change metal structure. 2. Capacity: Thickness of tin according to customers’ requirement; Single side laminating also ok. Laminating layer
Calidad Rollo de metal de chapa de cobre rojo de espesor 25um fábrica

Rollo de metal de chapa de cobre rojo de espesor 25um

Electrolytic 25um Thickness Red Copper Sheet Metal Roll Product Description This copper foil with 25 um thickness is the best candidate as substrate for growing Graphene. Copper strip is made of electrolytic copper and it goes through the processes of ingot, hot rolling, cold rolling, heat treatment, surface cleaning, cutting, finishing, and then packing. The material has excellent thermal and electrical conduction, flexible ductility and good corrosion resistance performance
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